​Welcome to Peak Asic's S19XP Hashboard repair guide! We specialize in providing expert Antminer hashboard repairs, but we understand that some of you might want to try repairing your devices yourself. To support your efforts, we've created this comprehensive guide to help you through the process. Follow the steps below, and feel free to reach out to us if you need professional assistance or would like to send in miners for repair.

 I. Preparation: Platform, Tools, and Equipment

 1. Platform Requirements:
- **Anti-static repair workbench:** Must be grounded to prevent static damage.
- **Anti-static wrist strap:** Ensure proper grounding.

 2. Equipment Requirements:
- **Constant temperature soldering iron:** Set between 350°C and 380°C (662°F - 716°F) with a fine tip for precision work on small chips like resistors and capacitors.
- **Heat gun and heating platform:** Operate between 350°C and 400°C.
- **BGA repair workstation:** Suitable for chip/BGA disassembly and soldering.
- **Multimeter:** Fluke 17B+ recommended, equipped with a heat-shrink-covered steel needle for accurate measurement.
- **Oscilloscope:** UTD2102CEX+ recommended.
- **Network cable:** Ensure a stable Internet connection.

 3. Testing Tool Requirements:
- **APW12 power supply:** Use APW1212V-15V and power adapter cable to build a test platform. Connect the PSU and hash board with thick copper wires (6AWG recommended, within 60cm).
- **Test fixture:** Use the V2.1010 control board (model ZJ0001000001). Install a discharge resistor on the positive and negative poles of the power supply, recommended 25 Ohm, 100W or higher cement resistors.

 4. Repair Auxiliary Materials:
- **Solder paste, flux, board cleaning solution, and absolute alcohol:** For cleaning flux residues after maintenance.
- **Thermal conductive gel:** Specification FujipolySPG-30B, applied on the chip surface after maintenance.
- **Reballing stencil:** Sized for 0.4mm diameter solder balls, and desoldering braid for cleaning up old solder.
- **Chip soldering:** Pre-tin new chip pins before soldering them to the hash board. Apply thermal conductive gel evenly on the chip surface before securing the heatsink.

 5. Repair Auxiliary Tools:
- **Scanning gun:** ZD2200 Wired Scanner recommended.
- **Adapter board:** RS232/TTL adapter board 3.3V.
- **Self-made short-circuit probes:** Made with needle wires and heat-shrinkable sleeves to prevent short circuits between probes and small heatsinks.

 6. Common Spare Parts:
- **0402 Resistors:** 0R, 51R, 10K, 4.7K.
- **0402 Capacitors:** 0.1uF, 1uF.

 II. Job Requirements

 1. Personnel Expertise:
- Repair technicians should have a solid understanding of electronics, with over a year of experience in BGA/QFN/LGA soldering techniques.

 2. Post-Maintenance Testing:
- Ensure the hash board passes at least two tests before considering it repaired.

 3. Soldering Technique:
- When replacing chips, ensure no PCB deformation occurs. Check for missing components, open circuits, or short circuits around the replaced parts.

 4. Chip Testing:
- Perform chip detection first, followed by functional testing. Ensure the small heatsink is properly soldered and the large heatsink is installed with evenly applied thermal adhesive. Use the chassis for heat dissipation by placing two hash boards to create an airflow channel.

 5. Power Connection Order:
- Connect the negative power cable first, then the positive, and finally the signal ribbon cable. Reverse this order during disassembly to avoid damaging components like U1 and U2.

 6. Test Setup:
- Confirm the test software parameters and test fixtures are appropriate for the maintenance station.

 7. Tool Functionality:
- Verify that all tools and test jigs are functioning correctly.

 8. Signal Measurement:
- Utilize four fans for cooling during signal measurements, operating them at full speed.

 9. New Chip Soldering:
- Pre-tin the pins of new chips before soldering them onto the PCBA. Evenly apply thermal gel on the chip surface before securing the heatsink.

 III. Test Fixture Fabrication and Precautions

- Ensure the test fixture provides adequate cooling for the hash board and facilitates easy signal measurement.

 1. Fixture Model:
- Use ZJ0001000001 Test fixture.

 2. FPGA Updates:
- Update the FPGA on the test fixture control board using an SD card. Insert the SD card into the slot, power on, and wait for the control board indicator light to flash three times to complete the update.

 3. Test SD Card Creation:
- For PT1 repairs, create an SD card with the PT1 program. Directly decompress the package to make the SD card for single-sided heatsink detection.

 IV. Principle and Structure of the Hash Board

 1. Working Structure of S19XP Hash Board:
- The hash board consists of 110 BM1366 chips, divided into 11 domains with 10 ASIC chips each.

 2. Chip Signal Direction:
- **CLK (OUT) Signal:** Generated by the Y1 25M crystal oscillator, traveling from chip 01 to chip 110 (0.6-0.7V).
- **TX (CI, CO) Signal:** Flows from pin 7 (3.3V) of the IO interface, transmitted from chip 01 to chip 110 after level conversion IC U10 (1.2V).
- **RX (RI, RX) Signal:** Travels from chip 110 to chip 01, returning to pin 8 of the signal cable terminal and then to the control board (1.2V during operation).
- **BO (BI, BO) Signal:** Travels from chip 01 to chip 110.
- **RST Signal:** Enters from pin 3 of the IO interface, traveling from chip 01 to chip 110 (1.2V during operation).

 3. Machine Structure:
- The entire miner is composed of three hash boards, one control board, one APW12 power supply, and four cooling fans.

 V. Common Faults and Troubleshooting Steps

 1. Symptom: Single Board Test Detects 0 Chips (PT1/PT2 Mode)

 Step 1: Check Power Supply Output
- Verify the power supply output.

 Step 2: Check Voltage Output of Voltage Domains
- Each voltage domain should be about 1.35V. If 14V is present, domain voltage should exist; measure the output at the hash board's power terminal.

 Step 3: Check Boost Circuit Output
- Test the EC5 point to measure 18V-19V.

 Step 4: Check Each Group of LDO (1.2V) or PLL (0.8V) Output
- Verify outputs from the LDO and PLL circuits.

 Step 5: Check Signal Output of the Chip (CLK/CI/RI/BO/RST)
- Measure and compare voltage values with adjacent groups if deviations are found.

 Step 6: EEPRXM NG on LCD Screen
- Inspect U6 soldering if EEPRXM NG is displayed.

 Step 7: Temperature Sensor Check
- Verify the soldering and power supply (3.3V) of the temperature sensor IC and nearby resistors.

 2. Symptom: Incomplete Chip Detection on Single Board (PT1/PT2 Mode)

 Step 1: Measure Domain Voltage and Boost Circuit
- Use a short-circuit probe between RX and 1V2 test points to run the chip detection program and check the log.

 Step 2: Check Voltages of 1V and 0.8V Test Points
- Measure voltages to ensure they are 1.2V and 0.8V respectively.

 Step 3: Inspect U1 and U2 Circuits
- Check for anomalies in these circuits.

 Step 4: Measure Resistors R8 and R9
- Ensure the resistance is within 10 ohms.

 Step 5: Check Chip Pins Soldering
- Verify proper soldering on the first chip pins.

 Step 6: Capacitor Connection Check
- Ensure the capacitor from R1104 to the boost circuit is connected properly.

 Step 7: Binary Search Method
- If one chip is found, use a binary search to locate faulty chips by shorting test points between chip groups.

 Step 8: Fixed Chip Reporting (ASICNG)
- Inspect and re-solder resistors related to CLK, CI, and BO if a specific chip is consistently reported.

 3. Symptom: Single Board Pattern NG (PT2 Mode)

 Step 1: Check Thermal Gel Quality
- Inspect the thermal gel application.

 Step 2: Replace Chips with Lowest Response Rate
- Swap chips with low response rates and retest.

 4. Symptom:  (Insufficient Response of X Chips)

 Repair Method 1: Measure Domain Voltage
- Compare the domain voltage of low-response chips to normal chips and replace if necessary.

 Repair Method 2: Swap High and Low Response Chips
- Swap chips with different response rates and retest.

 5. Symptom: PT1 Checks OK, PT2 Function Test Serial Port Continuous Running

 Repair Method: Use Short-Circuit Probe
- Short-circuit RX and 1.2V test points to identify and replace faulty chips.

 6. PT1 Test OK, PT2 Function Test Reports a Specific Chip NG

 Repair Method: Check Appearance and Measure Capacitors/Resistors
- Inspect and replace damaged components or faulty chips.

 VI. Control Board Faults and Solutions

 1. Miner Does Not Run

 Step 1: Check Voltage Output Points
- Verify

 voltage output and replace ICs for 3.3V short circuits.

 Step 2: Inspect Soldering of DDR/CPU
- Check and re-solder if necessary.

 Step 3: Update Flash Program with SD Card
- Follow proper steps to ensure successful flashing.

 2. Miner Cannot Find IP

 Check Network Port and CPU Soldering
- Inspect and re-solder if necessary.

 3. Miner Cannot Upgrade

 Check Network Port and CPU Soldering
- Inspect and re-solder if necessary.

 4. Miner Fails to Read Hash Board or Misses Connections

 Check Cable Connections
- Inspect ribbon cables and control board components.

 VII. Whole Miner Fault Symptoms

 1. Initial Testing

 Fan Abnormalities
- Check fan operation and connections.

 Missing Chains
- Inspect and test hash boards individually if one of the three is missing.

 Temperature Anomalies
- Ensure PCB temperature does not exceed 90°C. Check fan operation.

 Incomplete Chip Detection
- Use PT2 test to diagnose and repair.

 No Hash Rate
- Verify network connection.

 2. Aging Test

 Single Board Test OK, Low Hash Rate in Complete Miner
- Conduct single-board PT2 test and use Debug master program for further diagnosis.

 VIII. Routine Testing and Maintenance

 1. Visual Inspection
- Check for PCB deformation or burn marks.

 2. Impedance Testing
- Detect short circuits or open circuits in voltage domains.

 3. Voltage Testing
- Verify each domain's voltage is around 1.35V.

 4. Chip Detection
- Use test fixture to detect chips and diagnose based on results.

 5. Signal Direction
- Follow signal directions to identify abnormal fault points.

 6. Re-Soldering
- Apply flux, heat solder points, and re-tin chip pins as needed. Replace faulty chips if necessary.

 7. Post-Repair Testing
- Test the hash board twice to confirm it is OK. Record all maintenance and analysis results.

 8. Document Recording
- Maintain detailed repair/analysis records for feedback to production, after-sales, and R&D.

 9. Routine Aging Tests
- Reassemble the repaired hash boards into a complete miner for routine aging tests. Ensure all repaired items re-enter the production line starting from the first station to maintain quality continuity.