Welcome to Peak Asic's S21 Hashboard repair guide! We specialize in providing expert Antminer hashboard repairs, but we understand that some of you might want to try repairing your devices yourself. To support your efforts, we've created this comprehensive guide to help you through the process. Follow the steps below, and feel free to reach out to us if you need professional assistance or would like to send in miners for repair.
I. Preparation of Maintenance Platform, Tools, and Equipment
1. Platform Requirements:
- **Anti-static repair workbench:** Ensure it is grounded.
- **Anti-static wrist strap:** Must be grounded.
2. Equipment Requirements:
- **Thermostatic soldering iron:** Set at 350-380 degrees Celsius, with a fine-tip for soldering small SMD resistors and capacitors.
- **Hot air gun and BGA rework station:** For chip/BGA removal and soldering.
- **Multimeter:** Preferably a Fluke.
- **Soldering steel needles with heat-shrink tubing:** For easy measurement.
- **Oscilloscope and Ethernet cable:** For Internet connection, stable network required.
3. Repair Test Tools Requirements:
- **S21 power supply (APW171215a):** 12V-15V, V1.3, safety regulations (calibration). Alternatively, use other BOM power supplies and power adapter cables (DIY with thick copper wires for the positive and negative poles, recommended 4AWG copper wires, less than 60cm, only for PT1 and repair testing).
- **Fixture:** V2.1 or V2.3 control board (material number ZJ0001000004) with discharge resistors installed on the positive and negative poles (20 ohms, 100W cement resistors). First-time use of the 19 series universal test fixture requires flashing with B047 version (refer to the S21 test guidance document).
- **T21 PT3 test power supply (APW11A1216-1a):** 12V-16V, V1.1, safety regulations (calibration). PT1 can use a conventional 1215 PSU.
4. Repair Auxiliary Materials/Tools Requirements:
- **Solder paste (M705), flux, and cleaning solution:** Use anhydrous alcohol for cleaning flux residues after repair.
- **Thermal gel (Fujipoly SPG-30B):** For application on the chip surface after repair.
- **Tin tool stencil (BM1368 LGA 6mm * 8mm chip size), desoldering wire, and solder balls (0.4mm diameter recommended).**
- **Thermal paste:** Apply on the chip surface before attaching the large heatsink after repair.
5. Common Spare Parts for Repair:
- **SMD resistors:**
- 33 ohms, ±1%, 1/20W, R0201 (0603).
- 10K, ±1%, 1/16W, 0402.
- 0 ohms, ±5%, 1/16W, 0402.
- **SMD ceramic capacitors:**
- 1uF, +/-10%, 16V, X5R, 0402.
- 1uF, 6.3V, 20%, X5R, C0201 (0603).
- 22uF, +/-20%, 6.3V, X5R, 0603.
II. Repair Requirements
1. Chip Replacement:
- Pay attention to operation techniques and ensure no visible deformation of the PCB.
- Check for missing parts, open circuits, or short circuits around replaced components.
2. Personnel Expertise:
- Repair personnel must have electronic knowledge, at least one year of repair experience, and proficiency in BGA/QFN/LGA soldering techniques.
3. Post-Repair Testing:
- The hash board must pass testing at least twice with both results being OK.
- Each work order corresponds to unique hash board SNs.
- Ensure proper functioning of tools and testing fixtures, and correct test software parameters and fixture versions.
4. Testing After Chip Replacement:
- First perform a chip detection test, followed by the PT3 sweep function test.
- Ensure proper installation of the heatsink assembly with thermal gel and connect the fan to the test fixture for controlled testing.
5. Measurement Protocol:
- Use a fan to blow air on the TOP side when measuring signals and voltages with the heatsink attached.
6. New Chip Soldering:
- Use a tin stencil to apply solder paste to the chip pins, and ensure pre-tinning before soldering onto the PCBA.
- Apply thermal gel evenly on the chip surface before attaching the large heatsink.
7. Testing Modes:
- All fixtures at the repair end must use Test_Mode and scan mode for testing.
- After passing tests, the production end starts from the first test station and proceeds with normal machine assembly and aging.
8. Heat Sink Reinstallation:
- After confirming the PCBA is OK, reapply thermal paste before reinstallation and flow line testing to ensure proper machine operation.
III. Test Fixture Creation and Precautions
- Ensure the fixture meets the cooling requirements of the hash board and facilitates signal measurement.
1. Initial Use of BHB68XXX Series Test Fixture:
- Update the fixture control board's FPGA using an SD card with the program. Power on and wait for the control board indicator light to double blink 3 times, indicating the update is complete.
2. SD Card Preparation:
- For PT1 chip detection and PT3 function testing, create an SD card by decompressing the package and renaming the configuration file to "Config.ini".
IV. Principle Overview
1. T21 & S21 Hash Board Working Structure:
- The hash board is composed of 108 BM1368 chips, divided into 12 groups (domains) with 9 ASICs each. The working domain voltage is approximately 1.2V.
- From domain 1 to domain 10, chips are powered by 1.2V & 0.8V LDOs. Domains 11 and 12 use two MP2019 to output 2V, supplying the LDOs that then supply VDDIO to the chips.
2. Level Shifters:
- 11 level shifters powered by each domain voltages.
3. Temperature Sensors:
- Use U5 and U7 for temperature sensing, located at the inlet and outlet.
4. Boost Circuit:
- The boost is powered by the power supply and VDD_IN is converted to 25V through U206.
5. Chip Signal Flow:
- **CLK:** Generated by the Y1 25M crystal oscillator, flowing from chip BM1 to BM108.
- **TX (CI, CO) and RX (RI, RO):** TX flows from the IO port through U1, RX flows back through U2 to the control board.
- **BO (BI, BO) and RST:** BO flows from BM1 to BM108, RST enters from the IO port and flows similarly.
6. Whole Machine Architecture:
- The S21 miner comprises 3 hash boards, 1 control board, and an APW171215a power supply. The T21 miner has a similar structure but uses an APW11A1216-1a PSU.
V. Common Fault Phenomena and Troubleshooting Steps for Hash Board
1. Single Board Test Detects 0 Chips (PT1 Station):
- **Troubleshoot Power Output:** Measure voltage domain output (~1.1V).
- **Check CLK Output:** Measure at BM1 and the last chip.
- **Check LDO Outputs:** 1.2V or PLL 0.8V output.
- **Signal Outputs:** Check chip signal outputs against expected voltage ranges.
2. EEPROM NG:
- Check U6 and surrounding components for proper soldering and connections.
3. Sensor NG:
- Inspect U5 and U7 chips, SMD resistors, and capacitors for proper soldering and connections.
### 4. INIT NG TEMP:
- Inspect U4, U5, and adjacent SMD resistors and capacitors for proper soldering.
5. Incomplete Chip Detection (PT1/PT3 Stations):
- **ASIC NG (0):** Measure domain voltage, check chip signals and LDO circuit.
- **ASIC NG (X):** Check for poor soldering or chip defects.
6. Pattern NG:
- **Causes:** Damaged chip die, bridging, low domain voltage, or chip issues.
- **Action:** Measure domain voltage and repair as needed.
7. PT3 Nonce Response 0:
- Inspect chips and signal impedance in the first 6 domains.
8. PT3 Frequency Sweep Detection Failure:
- Inspect chip appearance for short circuits, solder bridges, or foreign objects.
9. Whole Machine Test R:1 Error:
- Use PT1 to check for chip abnormalities and perform repairs.
10. PT1 Chip Batch Abnormalities:
- Use a multimeter in ohm mode to measure corresponding impedance output.
VI. Control Board Issues
1. Whole Machine Does Not Operate:
- Check voltage output points, soldering conditions of DDR/CPU, and update the flash program using an SD card.
2. Cannot Find IP:
- Inspect Ethernet port, network transformer T1, and CPU for proper soldering.
3. Cannot Upgrade:
- Inspect Ethernet port, network transformer T1, and CPU for proper soldering.
4. Fails to Read Hash Boards or Missing Chains:
- Check ribbon cables, control board components, and soldering quality of pin headers.
VII. Whole Machine Fault Phenomena
1. Initial Whole Machine Test:
- Check for assembly and control board process problems. Repair based on monitoring interface and test LOG prompts.
2. Aging Test:
- **Fan Abnormality
:** Check fan operation and connections.
- **Missing Chains:** Inspect ribbon cables and test individual boards.
- **Temperature Anomaly:** Check ambient temperature, fan speed, and temperature sensors.
- **Incomplete Chip Detection:** Test single board with PT1 and repair accordingly.
- **No Hash Rate After Running:** Check network connection.
3. After-Sales Repair and PT1 Test Platform Construction:
- Use fans for heat dissipation during PT1 testing.
VIII. Other Precautions
Repair Flowchart:
- Perform visual inspection of the hash board for deformations or burns. Check for short or open circuits and voltage domain measurements.
- Use the test fixture to detect chips and locate faults.
- Re-solder faulty chips and test the hash board twice before confirming it is OK.
- Record maintenance/analysis results and perform routine aging for repaired hash boards.
- Reprint thermal grease on repaired hash boards before testing.
I. Preparation of Maintenance Platform, Tools, and Equipment
1. Platform Requirements:
- **Anti-static repair workbench:** Ensure it is grounded.
- **Anti-static wrist strap:** Must be grounded.
2. Equipment Requirements:
- **Thermostatic soldering iron:** Set at 350-380 degrees Celsius, with a fine-tip for soldering small SMD resistors and capacitors.
- **Hot air gun and BGA rework station:** For chip/BGA removal and soldering.
- **Multimeter:** Preferably a Fluke.
- **Soldering steel needles with heat-shrink tubing:** For easy measurement.
- **Oscilloscope and Ethernet cable:** For Internet connection, stable network required.
3. Repair Test Tools Requirements:
- **S21 power supply (APW171215a):** 12V-15V, V1.3, safety regulations (calibration). Alternatively, use other BOM power supplies and power adapter cables (DIY with thick copper wires for the positive and negative poles, recommended 4AWG copper wires, less than 60cm, only for PT1 and repair testing).
- **Fixture:** V2.1 or V2.3 control board (material number ZJ0001000004) with discharge resistors installed on the positive and negative poles (20 ohms, 100W cement resistors). First-time use of the 19 series universal test fixture requires flashing with B047 version (refer to the S21 test guidance document).
- **T21 PT3 test power supply (APW11A1216-1a):** 12V-16V, V1.1, safety regulations (calibration). PT1 can use a conventional 1215 PSU.
4. Repair Auxiliary Materials/Tools Requirements:
- **Solder paste (M705), flux, and cleaning solution:** Use anhydrous alcohol for cleaning flux residues after repair.
- **Thermal gel (Fujipoly SPG-30B):** For application on the chip surface after repair.
- **Tin tool stencil (BM1368 LGA 6mm * 8mm chip size), desoldering wire, and solder balls (0.4mm diameter recommended).**
- **Thermal paste:** Apply on the chip surface before attaching the large heatsink after repair.
5. Common Spare Parts for Repair:
- **SMD resistors:**
- 33 ohms, ±1%, 1/20W, R0201 (0603).
- 10K, ±1%, 1/16W, 0402.
- 0 ohms, ±5%, 1/16W, 0402.
- **SMD ceramic capacitors:**
- 1uF, +/-10%, 16V, X5R, 0402.
- 1uF, 6.3V, 20%, X5R, C0201 (0603).
- 22uF, +/-20%, 6.3V, X5R, 0603.
II. Repair Requirements
1. Chip Replacement:
- Pay attention to operation techniques and ensure no visible deformation of the PCB.
- Check for missing parts, open circuits, or short circuits around replaced components.
2. Personnel Expertise:
- Repair personnel must have electronic knowledge, at least one year of repair experience, and proficiency in BGA/QFN/LGA soldering techniques.
3. Post-Repair Testing:
- The hash board must pass testing at least twice with both results being OK.
- Each work order corresponds to unique hash board SNs.
- Ensure proper functioning of tools and testing fixtures, and correct test software parameters and fixture versions.
4. Testing After Chip Replacement:
- First perform a chip detection test, followed by the PT3 sweep function test.
- Ensure proper installation of the heatsink assembly with thermal gel and connect the fan to the test fixture for controlled testing.
5. Measurement Protocol:
- Use a fan to blow air on the TOP side when measuring signals and voltages with the heatsink attached.
6. New Chip Soldering:
- Use a tin stencil to apply solder paste to the chip pins, and ensure pre-tinning before soldering onto the PCBA.
- Apply thermal gel evenly on the chip surface before attaching the large heatsink.
7. Testing Modes:
- All fixtures at the repair end must use Test_Mode and scan mode for testing.
- After passing tests, the production end starts from the first test station and proceeds with normal machine assembly and aging.
8. Heat Sink Reinstallation:
- After confirming the PCBA is OK, reapply thermal paste before reinstallation and flow line testing to ensure proper machine operation.
III. Test Fixture Creation and Precautions
- Ensure the fixture meets the cooling requirements of the hash board and facilitates signal measurement.
1. Initial Use of BHB68XXX Series Test Fixture:
- Update the fixture control board's FPGA using an SD card with the program. Power on and wait for the control board indicator light to double blink 3 times, indicating the update is complete.
2. SD Card Preparation:
- For PT1 chip detection and PT3 function testing, create an SD card by decompressing the package and renaming the configuration file to "Config.ini".
IV. Principle Overview
1. T21 & S21 Hash Board Working Structure:
- The hash board is composed of 108 BM1368 chips, divided into 12 groups (domains) with 9 ASICs each. The working domain voltage is approximately 1.2V.
- From domain 1 to domain 10, chips are powered by 1.2V & 0.8V LDOs. Domains 11 and 12 use two MP2019 to output 2V, supplying the LDOs that then supply VDDIO to the chips.
2. Level Shifters:
- 11 level shifters powered by each domain voltages.
3. Temperature Sensors:
- Use U5 and U7 for temperature sensing, located at the inlet and outlet.
4. Boost Circuit:
- The boost is powered by the power supply and VDD_IN is converted to 25V through U206.
5. Chip Signal Flow:
- **CLK:** Generated by the Y1 25M crystal oscillator, flowing from chip BM1 to BM108.
- **TX (CI, CO) and RX (RI, RO):** TX flows from the IO port through U1, RX flows back through U2 to the control board.
- **BO (BI, BO) and RST:** BO flows from BM1 to BM108, RST enters from the IO port and flows similarly.
6. Whole Machine Architecture:
- The S21 miner comprises 3 hash boards, 1 control board, and an APW171215a power supply. The T21 miner has a similar structure but uses an APW11A1216-1a PSU.
V. Common Fault Phenomena and Troubleshooting Steps for Hash Board
1. Single Board Test Detects 0 Chips (PT1 Station):
- **Troubleshoot Power Output:** Measure voltage domain output (~1.1V).
- **Check CLK Output:** Measure at BM1 and the last chip.
- **Check LDO Outputs:** 1.2V or PLL 0.8V output.
- **Signal Outputs:** Check chip signal outputs against expected voltage ranges.
2. EEPROM NG:
- Check U6 and surrounding components for proper soldering and connections.
3. Sensor NG:
- Inspect U5 and U7 chips, SMD resistors, and capacitors for proper soldering and connections.
### 4. INIT NG TEMP:
- Inspect U4, U5, and adjacent SMD resistors and capacitors for proper soldering.
5. Incomplete Chip Detection (PT1/PT3 Stations):
- **ASIC NG (0):** Measure domain voltage, check chip signals and LDO circuit.
- **ASIC NG (X):** Check for poor soldering or chip defects.
6. Pattern NG:
- **Causes:** Damaged chip die, bridging, low domain voltage, or chip issues.
- **Action:** Measure domain voltage and repair as needed.
7. PT3 Nonce Response 0:
- Inspect chips and signal impedance in the first 6 domains.
8. PT3 Frequency Sweep Detection Failure:
- Inspect chip appearance for short circuits, solder bridges, or foreign objects.
9. Whole Machine Test R:1 Error:
- Use PT1 to check for chip abnormalities and perform repairs.
10. PT1 Chip Batch Abnormalities:
- Use a multimeter in ohm mode to measure corresponding impedance output.
VI. Control Board Issues
1. Whole Machine Does Not Operate:
- Check voltage output points, soldering conditions of DDR/CPU, and update the flash program using an SD card.
2. Cannot Find IP:
- Inspect Ethernet port, network transformer T1, and CPU for proper soldering.
3. Cannot Upgrade:
- Inspect Ethernet port, network transformer T1, and CPU for proper soldering.
4. Fails to Read Hash Boards or Missing Chains:
- Check ribbon cables, control board components, and soldering quality of pin headers.
VII. Whole Machine Fault Phenomena
1. Initial Whole Machine Test:
- Check for assembly and control board process problems. Repair based on monitoring interface and test LOG prompts.
2. Aging Test:
- **Fan Abnormality
:** Check fan operation and connections.
- **Missing Chains:** Inspect ribbon cables and test individual boards.
- **Temperature Anomaly:** Check ambient temperature, fan speed, and temperature sensors.
- **Incomplete Chip Detection:** Test single board with PT1 and repair accordingly.
- **No Hash Rate After Running:** Check network connection.
3. After-Sales Repair and PT1 Test Platform Construction:
- Use fans for heat dissipation during PT1 testing.
VIII. Other Precautions
Repair Flowchart:
- Perform visual inspection of the hash board for deformations or burns. Check for short or open circuits and voltage domain measurements.
- Use the test fixture to detect chips and locate faults.
- Re-solder faulty chips and test the hash board twice before confirming it is OK.
- Record maintenance/analysis results and perform routine aging for repaired hash boards.
- Reprint thermal grease on repaired hash boards before testing.