Welcome to Peak Asic's T19 Hashboard repair guide! We specialize in providing expert Antminer hashboard repairs, but we understand that some of you might want to try repairing your devices yourself. To support your efforts, we've created this comprehensive guide to help you through the process. Follow the steps below, and feel free to reach out to us if you need professional assistance or would like to send in miners for repair.
Maintenance Platform and Tools Preparation
1. Platform Requirements:
- **Workbench**: Use an anti static maintenance workbench that is grounded properly.
- **Anti-static Tools**: Employ an anti-static wristband grounded correctly to prevent ESD damage.
2. Equipment Requirements:
- **Soldering Iron**: Use a constant temperature soldering iron set between 350-380°C with a pointed tip for precision soldering.
- **Heat Gun and BGA Rework Station**: These are essential for chip and BGA disassembly and soldering tasks.
- **Multimeter and Oscilloscope**: A Fluke multimeter and an Agilent oscilloscope are recommended for accurate measurements.
3. Test Tool Requirements:
- **Power Supply**: Utilize the APW12 power supply (AP12_12V-15V_V1.2). Ensure to use thick copper wires (4AWG, <60cm) for connections.
- **Control Panel Test Fixture**: Use the 2.2010 control panel test fixture, ensuring discharge resistors (25 ohms, 100W) are installed on the power supply poles.
4. Auxiliary Materials and Tools:
- **Solder Paste and Flux**: Use Qianzhu M705 solder paste and flux for soldering.
- **Cleaning Agents**: Board washing water combined with absolute alcohol to clean flux residues.
- **Thermal Paste**: Apply thermal paste on chips/heat sinks post-maintenance.
- **Soldering Tools**: Include tin-planting stencils, ball-planting stencils, tin-absorbing wire, and 0.4mm diameter solder balls for chip replacement.
- **Short-Circuit Pin**: Use to short-circuit 1.8V and RO signal for problem diagnosis.
5. Spare Materials:
- **Resistors**: 0402 resistors (55R and 10K).
- **Capacitors**: 0402 capacitors (0.1uf, 1uf).
Maintenance Requirements
1. **Personnel**: Maintenance personnel should have substantial electronic knowledge and over one year of experience, proficient in BGA/QFN/LGA soldering techniques.
2. **Testing**: Ensure the computing board is tested more than twice post-repair, with all tests showing OK results.
3. **Chip Replacement**: Handle with care to avoid PCB deformation. Check for open or short circuits around replaced parts.
4. **Tool Functionality**: Verify the proper functioning of tools and fixtures, including maintenance station test software parameters.
5. **Functional Testing**: After chip replacement, ensure that the small heat sink is soldered correctly and the large heat sink is coated with thermal paste. Use the chassis for heat dissipation with full-speed fans.
Principle Overview
1. **Working Structure**: The T19 computing board operates with a series of voltage domains, each with multiple chips connected in sequence.
2. **Voltage Domains**: Specific voltage values should be maintained for proper functioning of the board.
Troubleshooting Process
Identifying and Replacing Faulty Chips:
1. **Initial Inspection**: Begin with a visual inspection of the board for any obvious issues such as displaced cooling fins or burned components.
2. **Impedance Check**: Measure the impedance of each voltage domain to identify any short or open circuits.
3. **Voltage Measurement**: Check the voltage at test points including CLK IN/OUT, TX IN/OUT, RX IN/OUT, and VDD (0.8V, 1.8V, 2.5V).
4. **Signal Flow**: Understand that signals, except RX, flow sequentially from the first chip to the last.
5. **Re-Soldering**: If a malfunctioning chip is identified, re-solder it carefully, applying solder paste and heating the pins to ensure proper contact.
6. **Testing**: Test the board using a hashboard tester, cooling the board completely between tests to ensure accurate results.
Detailed Voltage Checks
To find a malfunctioning chip by checking the RI (Reference Input) voltage, start from the last chip in the sequence and work backward to the first chip. The RI voltage should be consistent across all chips. Any significant deviation indicates a potential faulty chip. Measure and compare the following voltages:
- **VDD0V8**: 0.8V
- **VDD1V8**: 1.8V
- **VDD2V5**: 2.5V
By systematically measuring these voltages from the last chip to the first, you can pinpoint the exact location of the fault.
Final Notes
1. **Order of Operations**: When powering the hashboard, connect the negative power wire first, followed by the positive, and finally the signal cable. Reverse this order when disassembling.
2. **Heat Dissipation**: Ensure proper heat dissipation during testing and maintenance, using auxiliary fans and maintaining full-speed operation.
Following this detailed maintenance guide will help ensure accurate diagnosis and repair of the T19 computing boards, maintaining optimal performance and longevity of the hardware.
Maintenance Platform and Tools Preparation
1. Platform Requirements:
- **Workbench**: Use an anti static maintenance workbench that is grounded properly.
- **Anti-static Tools**: Employ an anti-static wristband grounded correctly to prevent ESD damage.
2. Equipment Requirements:
- **Soldering Iron**: Use a constant temperature soldering iron set between 350-380°C with a pointed tip for precision soldering.
- **Heat Gun and BGA Rework Station**: These are essential for chip and BGA disassembly and soldering tasks.
- **Multimeter and Oscilloscope**: A Fluke multimeter and an Agilent oscilloscope are recommended for accurate measurements.
3. Test Tool Requirements:
- **Power Supply**: Utilize the APW12 power supply (AP12_12V-15V_V1.2). Ensure to use thick copper wires (4AWG, <60cm) for connections.
- **Control Panel Test Fixture**: Use the 2.2010 control panel test fixture, ensuring discharge resistors (25 ohms, 100W) are installed on the power supply poles.
4. Auxiliary Materials and Tools:
- **Solder Paste and Flux**: Use Qianzhu M705 solder paste and flux for soldering.
- **Cleaning Agents**: Board washing water combined with absolute alcohol to clean flux residues.
- **Thermal Paste**: Apply thermal paste on chips/heat sinks post-maintenance.
- **Soldering Tools**: Include tin-planting stencils, ball-planting stencils, tin-absorbing wire, and 0.4mm diameter solder balls for chip replacement.
- **Short-Circuit Pin**: Use to short-circuit 1.8V and RO signal for problem diagnosis.
5. Spare Materials:
- **Resistors**: 0402 resistors (55R and 10K).
- **Capacitors**: 0402 capacitors (0.1uf, 1uf).
Maintenance Requirements
1. **Personnel**: Maintenance personnel should have substantial electronic knowledge and over one year of experience, proficient in BGA/QFN/LGA soldering techniques.
2. **Testing**: Ensure the computing board is tested more than twice post-repair, with all tests showing OK results.
3. **Chip Replacement**: Handle with care to avoid PCB deformation. Check for open or short circuits around replaced parts.
4. **Tool Functionality**: Verify the proper functioning of tools and fixtures, including maintenance station test software parameters.
5. **Functional Testing**: After chip replacement, ensure that the small heat sink is soldered correctly and the large heat sink is coated with thermal paste. Use the chassis for heat dissipation with full-speed fans.
Principle Overview
1. **Working Structure**: The T19 computing board operates with a series of voltage domains, each with multiple chips connected in sequence.
2. **Voltage Domains**: Specific voltage values should be maintained for proper functioning of the board.
Troubleshooting Process
Identifying and Replacing Faulty Chips:
1. **Initial Inspection**: Begin with a visual inspection of the board for any obvious issues such as displaced cooling fins or burned components.
2. **Impedance Check**: Measure the impedance of each voltage domain to identify any short or open circuits.
3. **Voltage Measurement**: Check the voltage at test points including CLK IN/OUT, TX IN/OUT, RX IN/OUT, and VDD (0.8V, 1.8V, 2.5V).
4. **Signal Flow**: Understand that signals, except RX, flow sequentially from the first chip to the last.
5. **Re-Soldering**: If a malfunctioning chip is identified, re-solder it carefully, applying solder paste and heating the pins to ensure proper contact.
6. **Testing**: Test the board using a hashboard tester, cooling the board completely between tests to ensure accurate results.
Detailed Voltage Checks
To find a malfunctioning chip by checking the RI (Reference Input) voltage, start from the last chip in the sequence and work backward to the first chip. The RI voltage should be consistent across all chips. Any significant deviation indicates a potential faulty chip. Measure and compare the following voltages:
- **VDD0V8**: 0.8V
- **VDD1V8**: 1.8V
- **VDD2V5**: 2.5V
By systematically measuring these voltages from the last chip to the first, you can pinpoint the exact location of the fault.
Final Notes
1. **Order of Operations**: When powering the hashboard, connect the negative power wire first, followed by the positive, and finally the signal cable. Reverse this order when disassembling.
2. **Heat Dissipation**: Ensure proper heat dissipation during testing and maintenance, using auxiliary fans and maintaining full-speed operation.
Following this detailed maintenance guide will help ensure accurate diagnosis and repair of the T19 computing boards, maintaining optimal performance and longevity of the hardware.